|
DS DS/CECC 265001 |
Technology Approval Schedule: Film and hybrid integrated circuits |
|
DS DS/CECC 30801- 802 |
Detail specification: Fixed tantalum surface mount capacitors with solid electrolyte and porous anode: Extended range |
|
DS DS/CECC 96601 |
Blank Detail Specification: Slide switches |
|
DS DS/CECC 96701 |
Blank Detail Specification: Dual-in-line switches |
|
DS DS/CLC/R 217- 001 |
Basic information on submicron CMOS technology assessment flow |
|
DS DS/CLC/R 217- 004 |
JESSI 0.8 æm CMOS transistor model for analogue and digital circuit simulation |
|
DS DS/CLC/R 217- 005 |
Measurement techniques for the characterization of the European mini test chip |
|
DS DS/CLC/R 217- 006 |
Parameter extraction techniques for the European mini test chip |
|
DS DS/CLC/R 217- 011 |
Electronic system specification languages - Express information model VHDL 87 |
|
DS DS/CLC/R 217- 012 |
Electronic system specification languages - VHDL 93 information core model |
|
DS DS/CLC/R 217- 014 |
EDA framework - Task and session information model |
|
DS DS/CLC/R 217- 015 |
Pinnacles Component Information Standard 1.2 - PCIS Tutorial |
|
DS DS/CLC/R 217- 016 |
Pinnacles Component Information Standard 1.2 - PCIS Sample Documents |
|
DS DS/CLC/R 217- 018 |
Report on the Viability of EDIF PCB Version (3 5 0) |
|
DS DS/CLC/TR 50448 |
Guide to levels of competence required in laser safety |
|
DS DS/EN 100114- 1 |
Rule of Procedure - Quality Assessment Procedures - Part 1: CECC requirements for the approval of an organization |
|
DS DS/EN 100114- 6 |
Rule of procedure 14: Quality assessment procedures - Part 6: Technology approval of electronic component manufacturers |
|
DS DS/EN 100114- 6/A1 |
CECC Quality assessment procedure for electronic component - Part 6: Technology approval of manufacturers-(AMENDS DS/EN 100114-6) |
|
DS DS/EN 116203 |
Blank detail specification: Electromechanical all-or-nothing relays for enhanced industrial application |
|
DS DS/EN 116204 |
Blank detail specification: Electromechanical all-or-nothing sealed relays for aggressive industrial application |
|
DS DS/EN 116205/116206/116207 |
Blank Detail Specification: Hermetically sealed relays - For severe static environmental conditions (116205) - For severe mobile environmental conditions (116206) - For severe airborne environmental conditions (116207) |
|
DS DS/EN 116300 |
Sectional Specification: Electromechanical All-Or-Nothing Heavy Load Relays of Assessed Quality (Rated from 5 A and above) |
|
DS DS/EN 116303 |
Blank Detail Specification: Electromechanical All-Or-Nothing Heavy Load Relays of Assessed Quality (Hermetically Sealed, 5 A to 25 A) |
|
DS DS/EN 116500 |
Sectional specification: Electromechanical all-or-nothing TELECOM relays of assessed quality |
|
DS DS/EN 116501 |
Blank detail specification: Electromechanical all-or-nothing TELECOM relays of assessed quality |
|
DS DS/EN 116502 |
Blank detail specification: Electromechanical all-or-nothing TELECOM relays of assessed quality, dual-in-line, with 20 x 10 mm base |
|
DS DS/EN 116503 + A1 |
Blank detail specification: Electromechanical all-or-nothing TELECOM relays of assessed quality, dual-in-line, with 14 x 9 mm base |
|
DS DS/EN 116504 + CORR. |
Blank Detail Specification: Electromechanical all-or-nothing TELECOM relays of assessed quality, dual-in-line, with 15 x 7,5 mm base, 2 change-over contacts |
|
DS DS/EN 123000+A1,2 |
Generic Specification - Printed boards |
|
DS DS/EN 123200+A1 |
Sectional Specification: Single and double sided printed boards with plated-through holes |
|
DS DS/EN 123300+A1 |
Sectional Specification: Multilayer printed boards |
|
DS DS/EN 123400+A2 |
Sectional Specification - Flexible printed boards without through connections |
|
DS DS/EN 123400- 800 |
Capability Detail Specification - Flexible printed boards without through connections |
|
DS DS/EN 123500+A2 |
Sectional Specification: Flexible printed boards with through connections |
|
DS DS/EN 123600 |
Sectional Specification: Flex-rigid multilayer printed boards with through connections |
|
DS DS/EN 123700 |
Sectional Specification: Flex-rigid double sided printed boards with through connections |
|
DS DS/EN 123800 |
Sectional Specification: Flexible multilayer printed boards with through connections |
|
DS DS/EN 12626 |
Safety of machinery - Laser processing machines - Safety requirements |
|
DS DS/EN 130100 |
Sectional Specification: Fixed polyethylene-terephtalate film dielectric metal foil capacitors for direct current |
|
DS DS/EN 130101 |
Sectional Specification: Fixed polyethylene-terephtalate film dielectric metal foil capacitors for direct current - Assessment level E |
|
DS DS/EN 130102 |
Sectional Specification: Fixed polyethylene-terephtalate film dielectric metal foil capacitors for direct current - Assesment level EZ |
|
DS DS/EN 130200+A3 |
Sectional Specification: Fixed Tantalum Capacitors with Non- Solid or Solid Electrolyte |
|
DS DS/EN 130201+A2 |
Blank Detail Specification: Fixed Tantalum Capacitors with Solid Electrolyte, Porous Anode |
|
DS DS/EN 130202 |
Blank Detail Specifiation: Fixed tantalum capacitors with non-solid electrolyte, porous anode (sub-family 2) |
|
DS DS/EN 130300 |
Sectional Specification: Aluminium electrolytic capacitors with solid and non-solid electrolyte |
|
DS DS/EN 130301 |
Blank Detail Specification: Aluminium electrolytic capacitors with non-solid electrolyte |
|
DS DS/EN 130500 |
Sectional Specification: Fixed metallized polycarbonate film dielectric capacitors for direct current |
|
DS DS/EN 130501 |
Blank Detail Specification: Fixed metallized polycarbonate film dielectric capacitors for direct current - Assessment level E |
|
DS DS/EN 130502 |
Blank Detail Specification: Fixed metallized polycarbonate film dielectric capacitors for direct current - Assessment level EZ |
|
DS DS/EN 130800 |
Sectional Specification: Tantalum surface mounting capacitors |
|
DS DS/EN 130800/A1 |
Sectional Specification: Tantalum surface mounting capacitors- (AMENDS DS/EN 130800) |
|
DS DS/EN 130801 |
Blank Detail Specification: Tantalum surface mounting capacitors |
|
DS DS/EN 130900 |
Sectional Specification: Fixed polystyrene film dielectric metal foil d.c. capacitors |
|
DS DS/EN 131200 |
Sectional Specification - Fixed capacitors with metallized electrodes and polypropylene dielectric |
|
DS DS/EN 131201 |
Blank Detail Specification: Fixed capacitors with metallized electrodes and polypropylene dielectric |
|
DS DS/EN 131701 |
Blank Detail Specification: Fixed capacitors for direct current with electrodes of thin metal foils and a polycarbonate film dielectric - Assessment level E |
|
DS DS/EN 133100 |
Sectional Specification: Passive filter units for electromagnetic interference suppression - Filters for which safety tests are not required |
|
DS DS/EN 133101 |
Blank Detail Specification: Passive filter units for electromagnetic interference suppression - Filters for which safety tests are not required |
|
DS DS/EN 133200 |
Sectional Specification: Passive filter units for electromagnetic interference suppression - (Filters for which safety tests are required) |
|
DS DS/EN 133201 |
Blank Detail Specification: Passive filter units for electromagnetic interference suppression. Filters for which safety tests are required |
|
DS DS/EN 133221 |
Blank Detail Specification: Passive filter units for electromagnetic interference suppression - Filters for which safety tests are required (safety tests only) |
|
DS DS/EN 140100/A1 |
Sectional specification: Fixed low power non-wire wound resistors-(AMENDS DS/EN 140100) |
|
DS DS/EN 140200/A1 |
Sectional Specification: Fixed power resistors-(AMENDS DS/EN 140200) |
|
DS DS/EN 140400 |
Sectional specification - Fixed low power surface mount (SMD) resistors |
|
DS DS/EN 140401 |
Blank Detail Specification - Fixed low power non wire-wound surface mount (SMD) resistors |
|
DS DS/EN 140401- 801 |
Detail Specification - Fixed low power non wire-wound surface mount (SMD) resistors - Rectangular - Stability classes 0,1; 0,25; 0,5; 1 |
|
DS DS/EN 140401- 801/A1 |
Detail Specification - Fixed low power non wire-wound surface mount (SMD) resistors - Rectangular - Stability classes 0,1; 0,25; 0,5; 1-(AMENDS DS/EN 140401-801) |
|
DS DS/EN 140401- 802 |
Detail specification - Fixed low power non wire-wound surface mount (SMD) resistors - Rectangular - Stability classes 1; 2 |
|
DS DS/EN 140401- 802/A1 |
Detail specification: Fixed low power non wire-wound surface mount (SMD) resistors - Rectangular - Stability classes 1; 2-(AMENDS DSF 46745) |
|
DS DS/EN 140401- 803 |
Detail specification - Fixed low power non wire-wound surface mount (SMD) resistors - Cylindrical - Stability classes 0,05; 0,1; 0,25; 0,5; 1; 2 |
|
DS DS/EN 140401- 803/A1 |
Detail specification - Fixed low power non wire-wound surface mount (SMD) resistors - Cylindrical - Stability classes 0,05; 0,1; 0,25; 0,5; 1; 2-(AMENDS DS/EN 140401-803) |
|
DS DS/EN 140401- 804 |
Detail specification: Fixed low power non wirewound high stability surface mount (SMD) resistors Rectangular Stability classes 0,1; 0,25 |
|
DS DS/EN 140402 |
Blank Detail Specification: Fixed low power wire wound surface mounting (SMD) resistors |
|
DS DS/EN 140402- 801 |
Detail specification: Fixed low power wire-wound surface mount (SMD) resistors - Rectangular Stability classes 0,5; 1; 2 |
|
DS DS/EN 147000 |
Generic specification: Sockets for use with electrical relays of assessed quality |
|
DS DS/EN 147100 |
Sectional specification: Relay sockets of assessed quality |
|
DS DS/EN 147101 |
Blank detail specification: Relay sockets of assessed quality |
|
DS DS/EN 150014 |
Blank Detail Specification: Thyristor diodes, transient overvoltage suppressor |
|
DS DS/EN 153000 |
General specification: Discrete pressure contact power semiconductor devices (Qualification approval) |
|
DS DS/EN 160100 |
Sectional specification: Capability approval of manufacturers of printed board assemblies of assessed quality |
|
DS DS/EN 160101 |
Blank detail specification: Printed board assembly modular electronic units of assessed quality. Capability approval |
|
DS DS/EN 160200- 1 |
Sectional Specification: Microwave modular electronic units of assessed quality - Part 1: Capability approval procedure |
|
DS DS/EN 160200- 2 |
Sectional specification: Microwave modular electronic units of assessed quality - Part 2: Index of test methods |
|
DS DS/EN 160201 |
Blank detail specification: Microwave modular electronic units of assessed quality - Capability Approval |
|
DS DS/EN 166100 |
Sectional Specification: Surface acoustic wave (SAW) filters |
|
DS DS/EN 166101 |
Blank detail specification: Surface acoustic wave (SAW) filters - Capability approval |
|
DS DS/EN 170000 |
Generic specification: Waveguide type dielectric resonators |
|
DS DS/EN 170100 |
Sectional specification: Waveguide type dielectric resonators |
|
DS DS/EN 170101 |
Blank detail Specification: Waveguide type dielectric resonators - Capacity approval |
|
DS DS/EN 171000 |
Generic specification: Filters using waveguide type dielectric resonators |
|
DS DS/EN 175101- 809 |
Detail specification: Two-part connectors for printed boards having a grid of 2,54 mm, short version in compliance with CECC 75 101-801, with assessed quality- Corrigendum 1:8/24/2005 |
|
DS DS/EN 175101- 820 |
Detail specification: Two-part connectors for printed boards for high number of contacts with basic grid of 2,54 mm on 3 or 4 rows |
|
DS DS/EN 175201- 804 |
Detail specification: Circular connectors - Round contacts, size diameter 1,6 mm, threaded coupling |
|
DS DS/EN 175301- 801 |
Detail specification: High density rectangular connectors, round removable crimp contacts |
|
DS DS/EN 175301- 803 |
Detail specification: Rectangular connectors - Flat contacts, 0,8 mm thickness, locking screw not detachable |
|
DS DS/EN 190000 |
Generic Specification: Monolithic integrated circuits |
|
DS DS/EN 196000+A1 |
Generic Specification - Electromechanical switches |
|
DS DS/EN 196103 |
Blank Detail Specification: Rotary switches - Assessment level Y |
|
DS DS/EN 196110 |
Sectional Specification: Rotary switches - Capability approval |
|
DS DS/EN 196403 |
Blank Detail specification: Push button switches - Assessment level Y |
|
DS DS/EN 28877 |
Information technology - Telecommunications and information exchange between systems - Interface connector and contact assignments for ISDN Basic Access Interface located at reference points S and T |
|
DS DS/EN 31252 |
Lasers and laser related equipment - Laser device - Minimum requirements for documentation |
|
DS DS/EN 50065-4- 4 |
Signalling on low-voltage electrical installations in the frequency range 3 kHz to 148,5 kHz - Part 4-4: Low voltage decoupling filter - Impedance filter |
|
DS DS/EN 50065-4- 5 |
Signalling on low-voltage electrical installations in the frequency range 3 kHz to 148,5 kHz - Part 4-5: Low voltage decoupling filter - Segmentation filter |
|
DS DS/EN 50324- 1 |
Piezoelectric properties of ceramic materials and components - Part 1: Terms and definitions |
|
DS DS/EN 50324- 2 |
Piezoelectric properties of ceramic materials and components - Part 2: Methods of measurement - Low power |
|
DS DS/EN 50324- 3 |
Piezoelectric properties of ceramic materials and components - Part 3: Methods of measurement - High power |
|
DS DS/EN 50419+CORR. |
Marking of electrical and electronic equipment in accordance with Article 11(2) of Directive 2002/96/EC (WEEE) |
|
DS DS/EN 59008-5- 2 |
Data requirements for semiconductor die - Part 5-2: Particular requirements and recommendations for die types - Bare die with added connection structures |
|
DS DS/EN 60062 |
Marking codes for resistors and capacitors |
|
DS DS/EN 60115- 1+A1 |
Fixed resistors for use in electronic equipment - Part 1: Generic specification |
|
DS DS/EN 60115- 9 |
Fixed resistors for use in electronic equipment - Part 9: Sectional specification - Fixed surface mount resistor networks with individually measurable resistors |
|
DS DS/EN 60115-9- 1 |
Fixed resistors for use in electronic equipment - Part 9-1: Blank detail specification - Fixed surface mount resistor networks with individually measurable resistors - Assessment level EZ |
|
DS DS/EN 60122- 1 |
Quartz crystal units of assessed quality - Part 1: Generic specification |
|
DS DS/EN 60122- 3 |
Quartz crystal units of assessed quality - Part 3: Standard outlines and lead connections |
|
DS DS/EN 60130- 17 |
Connectors for frequencies below 3 MHz - Part 17: Detail specification for interconnection devices which permit multi-directional mating, for use with rechargeable batteries |
|
DS DS/EN 60130- 9 |
Connectors for frequencies below 3 MHz - Part 9: Circular connectors for radio and associated sound equipment |
|
DS DS/EN 60139 |
Preparation of outline drawings for cathode-ray tubes, their components, connections and gauges |
|
DS DS/EN 60143- 1 |
Series capacitors for power systems - Part 1: General |
|
DS DS/EN 60143- 3 |
Series capacitors for power systems - Part 3: Internal fuses |
|
DS DS/EN 60191- 3 |
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits |
|
DS DS/EN 60191- 4 |
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages |
|
DS DS/EN 60191- 4/A1 |
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages- (AMENDS DS/EN 60191-4) |
|
DS DS/EN 60191- 4/A2 |
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages- (AMENDS DS/EN 60191-4) |
|
DS DS/EN 60191-6- 1 |
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals |
|
DS DS/EN 60191-6- 10 |
Mechanical standardization of semiconductor devices Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Dimensions of P-VSON |
|
DS DS/EN 60191-6- 12 |
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type |
|
DS DS/EN 60191-6- 2 |
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages |
|
DS DS/EN 60191-6- 2/CORR.1 |
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages |
|
DS DS/EN 60191-6- 3 |
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) |
|
DS DS/EN 60191-6- 4 |
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) |
|
DS DS/EN 60191-6- 5 |
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) |
|
DS DS/EN 60191-6- 6 |
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA) |
|
DS DS/EN 60191-6- 8 |
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP) |
|
DS DS/EN 60249-2- 1/A4 |
Base materials for printed circuits - Part 2: Specifications - Specification No. 1: Phenolic cellulose paper copper-clad laminated sheet, high electrical quality-(AMENDS DS/EN 60249-2-1 + Corr. + A2,3) |
|
DS DS/EN 60249-2- 10/A5 |
Base materials for printed circuits - Part 2: Specifications - Specification No. 10: Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)-(AMENDS DS/EN 60249-2-10 + Corr. + A3,4) |
|
DS DS/EN 60249-2- 11/A4 |
Base materials for printed circuits - Part 2: Specifications - Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards-(AMENDS DS/EN 60249- 2-11 + A2, |
|
DS DS/EN 60249-2- 12/A4 |
Base materials for printed circuits - Part 2-12: Specifications: thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards-(AMENDS DS/EN 60249-2-12 + A2,3) |
|
DS DS/EN 60249-2- 14/A5 |
Base materials for printed circuits - Part 2: Specifications - Specificaton No. 14: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test), economic quality-(AMENDS DS/EN 60249-2-14 + A3,4) |
|
DS DS/EN 60249-2- 16/A3 |
Base materials for printed circuits - Part 2: Specifications - Specificaton No. 16: Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)-(AMENDS DS/EN 60249-2-16 A1,2) |
|
DS DS/EN 60249-2-17 + A1,2 |
Base materials for printed circuits - Part 2: Specifications - Specificaton No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board |
|
DS DS/EN 60249-2- 17/A3 |
Base materials for printed circuits - Part 2: Specifications - Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards-(AMENDS DS/EN 60249-2-17 + A |
|
DS DS/EN 60249-2- 18/A3 |
Base materials for printed circuits - Part 2: Specifications - Specificaton No. 18: Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)-(AMENDS DS/EN 60249-2- 18+A1,2) |
|
DS DS/EN 60249-2- 2/A5 |
Base materials for printed circuits - Part 2: Specifications - Specification No. 2: Phenolic cellulose paper copper-clad laminated sheet, economic quality- (AMENDS DS/EN 60249-2-2 + Corr. + A3,4) |
|
DS DS/EN 60249-2- 3/A4 |
Base materials for printed circuits - Part 2: Specifications - Specification No. 3: Epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)-(AMENDS DS/EN 60249-2-3 + Corr. + A2,3) |
|
DS DS/EN 60249-2- 4/A5 |
Base materials for printed circuits - Part 2: Specifications - Specification No. 4: Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade-(AMENDS DS/EN 60249-2-4 + Corr. + A3,4) |
|
DS DS/EN 60249-2- 5/A5 |
Base materials for printed circuits - Part 2: Specifications - Specification No. 5: Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)-(AMENDS DS/EN 60249-2-5 + Corr. + A3,4) |
|
DS DS/EN 60249-2- 6 |
Materials for printed boards and other interconnecting structures - Part 2- 6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E- glass reinforced laminated sheets of defined flammability (vertical burning test), copper- clad |
|
DS DS/EN 60249-2- 6/A4 |
Base materials for printed circuits - Part 2: Specifications - Specification No. 6: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (horizontal burning test)-(AMENDS DS/EN 60249-2-6 + Corr. + A2,3) |
|
DS DS/EN 60249-2- 7/A4 |
Base materials for printed circuits - Part 2: Specifications - Specification No. 7: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)-(AMENDS DS/EN 60249-2-7 + Corr. + A2,3) |
|
DS DS/EN 60249-2- 9/A5 |
Base materials for printed circuits - Part 2: Specifications - Specification No. 9: Epoxide cellulose paper core, epoxide glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test)-(AMENDS DS/EN 60249-2-9 + Corr. + A3 |
|
DS DS/EN 60252- 1 |
AC Motor capacitors - Part 1: General - Performance, testing and rating - Safety requirements - Guide for installation and operation |
|
DS DS/EN 60252- 2 |
AC motor capacitors - Part 2: Motor start capacitors |
|
DS DS/EN 60286- 1 |
Packaging of components for automatic handling - Part 2: Tape packaging of components with axial leads on continuous tapes |
|
DS DS/EN 60286- 2 |
Packaging of components for automatic handling - Part 2: Tape packaging of components with unidirectional leads on continuous tapes |
|
DS DS/EN 60286- 2/A1 |
Packaging of components for automatic handling - Part 2: Tape packaging of components with unidirectional leads on continuous tapes-(AMENDS DS/EN 60286-2) |
|
DS DS/EN 60286- 3 |
Packaging of components for automatic handling. Part 3: Packaging of leadless components on continuous tapes. |
|
DS DS/EN 60286- 4 |
Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of form E and G |
|
DS DS/EN 60286- 5 |
Packaging of components for automatic handling - Part 5: Matrix trays |
|
DS DS/EN 60286- 6 |
Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components |
|
DS DS/EN 60297-3- 101 |
Mechanical structures for electronic equipment Dimensions of mechanical structures of the 482,6 mm (19 in) series Part 3-101: Subracks and associated plug-in units-Supersedes DS/EN 60297-5-100:2001, DS/EN 60297-4:1995, DS/EN 60297- 4/A1:1999, DS/EN 602 |
|
DS DS/EN 60297-3- 102 |
Mechanical structures for electronic equipment Dimensions of mechanical structures of the 482,6 mm (19 in) series Part 3-102: Injector/extractor handle |
|
DS DS/EN 60297-3- 103 |
Mechanical structures for electronic equipment Dimensions of mechanical structures of the 482,6 mm (19 in) series Part 3-103: Keying and alignment pin |
|
DS DS/EN 60352- 1/CORR. |
Solderless connections - Part 1: Wrapped connections - General requirements, test methods and practical guidance |
|
DS DS/EN 60352- 4+A1 |
Solderless connections - Part 4: Solderless non-accessible insulation displacement connections - General requirements, test methods and practical guidance |
|
DS DS/EN 60352- 5 |
Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance |
|
DS DS/EN 60352- 5/A1 |
Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance-(AMENDS DS/EN 60352-5) |
|
DS DS/EN 60352- 6 |
Solderless connections - Part 6: Insulation piercing connections - General requirements, test methods and practical guidance |
|
DS DS/EN 60352- 7 |
Solderless connections - Part 7: Spring clamp connections - General requirements, test methods and practical guidance |
|
DS DS/EN 60368- 1 |
Piezoelectric filters of assessed quality - Part 1: Generic specification |
|
DS DS/EN 60368- 1/A1 |
Piezoelectric filters of assessed quality - Part 1: Generic specification- (AMENDS DS/EN 60368-1) |
|
DS DS/EN 60368- 1/CORR. |
Piezoelectric filters of assessed quality - Part 1: Generic specification |
|
DS DS/EN 60368-2- 2 |
Piezoelectric filters - Part 2: Guide to the use of piezoelectric filters - Section 2: Piezoelectric ceramic filters |
|
DS DS/EN 60368- 3 |
Piezoelectric filters of assessed quality - Part 3: Standard outlines and lead connections |
|
DS DS/EN 60368- 4 |
Piezoelectric filters of assessed quality - Part 4: Sectional specification - Capability approval |
|
DS DS/EN 60368- 4/CORR. |
Piezoelectric filters of assessed quality - Part 4: Sectional specification - Capability approval |
|
DS DS/EN 60368-4- 1 |
Piezoelectric filters of assessed quality - Part 4-1: Blank detail specification - Capability approval |
|
DS DS/EN 60368-4- 1/CORR. |
Piezoelectric filters of assessed quality - Part 4-1: Blank detail specification - Capability approval |
|
DS DS/EN 60384- 1 |
Fixed capacitors for use in electronic equipment - Part 1: Generic specification |
|
DS DS/EN 60384- 14 |
Fixed capacitors for use in electronic equipment Part 14: Sectional specification Fixed capacitors for electromagnetic interference suppression and connection to the supply mains |
|
DS DS/EN 60384-14- 1 |
Fixed capacitors for use in electronic equipment Part 14-1: Blank detail specification Fixed capacitors for electromagnetic interference suppression and connection to the supply mains Assessment level D |
|
DS DS/EN 60384-14- 2 |
Fixed capacitors for use in electronic equipment - Part 14-2: Blank detail specification - Fixed capacitors for electromagnetic interference suppression and connection to the supply mains - Safety tests only |
|
DS DS/EN 60384-14- 3 |
Fixed capacitors for use in electronic equipment Part 14-3: Blank detail specification Fixed capacitors for electromagnetic interference suppression and connection to the supply mains Assessment level DZ |
|
DS DS/EN 60384- 20 |
Fixed capacitors for use in electronic equipment - Part 20: Sectional specification: Fixed metallized polyphenylene sulfide film dielectric surface mount D.C. capacitors |
|
DS DS/EN 60384-20- 1 |
Fixed capacitors for use in electronic equipment - Part 20: Blank detail specification: Fixed metallized polyphenylene sulfide film dielectric chip d.c. capacitors - Assessment level E |
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DS DS/EN 60384- 21 |
Fixed capacitors for use in electronic equipment - Part 21: Sectional specification: Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1 |
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DS DS/EN 60384-21- 1 |
Fixed capacitors for use in electronic equipment - Part 21-1: Blank detail specification: Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1 - Assessment level EZ |
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DS DS/EN 60384- 22 |
Fixed capacitors for use in electronic equipment - Part 22: Sectional specification: Fixed surface mount multilayer capacitors of ceramic dielectric, Class 2 |
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DS DS/EN 60384-22- 1 |
Fixed capacitors for use in electronic equipment - Part 22-1: Blank detail specification: Fixed surface mount multilayer capacitors of ceramic dielectric, Class 2 - Assessment level EZ |
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DS DS/EN 60384- 23 |
Fixed capacitors for use in electronic equipment Part 23: Sectional specification - Fixed surface mount metallized polyethylene naphthalate film dielectric DC capacitors |
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DS DS/EN 60384-23- 1 |
Fixed capacitors for use in electronic equipment Part 23-1: Blank detail specification Fixed surface mount metallized polyethylene naphthalate film dielectric DC capacitors Assessment level EZ |
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DS DS/EN 60384- 8 |
Fixed capacitors for use in electronic equipment Part 8: Sectional specification: Fixed capacitors of ceramic dielectric, Class 1 |
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DS DS/EN 60384-8- 1 |
Fixed capacitors for use in electronic equipment Part 8-1: Blank detail specification Fixed capacitors of ceramic dielectric, Class 1 Assessment level EZ |
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DS DS/EN 60384- 9 |
Fixed capacitors for use in electronic equipment Part 9: Sectional specification: Fixed capacitors of ceramic dielectric, Class 2 |
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DS DS/EN 60384-9- 1 |
Fixed capacitors for use in electronic equipment Part 9-1: Blank detail specification: Fixed capacitors of ceramic dielectric, Class 2 Assessment level EZ |
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DS DS/EN 60444- 1/A1 |
Measurement of quartz crystal unit parameters by zero phase technique in a pi-network - Part 1: Basic method for the measurement of resonance frequency and resonance resistance of quartz crystal units by zero phase technique in a pi- network-(AMENDS DS/EN |
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DS DS/EN 60444- 7 |
Measurement of quartz crystal unit parameters - Part 7: Measurement of activity and frequency dips of quartz crystal units |
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DS DS/EN 60444- 8 |
Measurement of quartz crystal unit parameters - Part 8: Test fixture for surface mounted quartz crystal units |
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DS DS/EN 60512- 1 |
Connectors for electronic equipment - Tests and measurements - Part 1: General |
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DS DS/EN 60512-10- 4 |
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 10: Impact tests (free components), static load tests (fixed components), endurance tests and overload tests - Section 4: Test 10d: Electrical ov |
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DS DS/EN 60512-10- 4 |
Connectors for electronic equipment - Tests and measurements - Part 10-4: Impact tests (free components), static load tests (fixed components), endurance tests and overload tests - Test 10d: Electrical overload (connectors) |
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DS DS/EN 60512-1- 1 |
Connectors for electronic equipment - Tests and measurements - Part 1- 1: General examination - Test 1a: Visual examination |
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DS DS/EN 60512-1- 100 |
Connectors for electronic equipment - Tests and measurements - Part 1-100: General - Applicable publications |
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DS DS/EN 60512-11- 1 |
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 11: Climatic tests - Section 1: Test 11a: Climatic sequence |
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DS DS/EN 60512-11- 10 |
Connectors for electronic equipment - Tests and measurements - Part 11-10: Climatic tests - Test 11j: Cold |
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DS DS/EN 60512-11- 11 |
Connectors for electronic equipment - Tests and measurements - Part 11-11: Climatic tests - Test 11k: Low air pressure |
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DS DS/EN 60512-11- 12 |
Connectors for electronic equipment - Tests and measurements - Part 11-12: Climatic tests - Test 11m: Damp heat, cyclic |
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DS DS/EN 60512-11- 13 |
Connectors for electronic equipment - Tests and measurements - Part 11-13: Climatic tests - Test 11n: Gas tightness, solderless wrapped connections |
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DS DS/EN 60512-11- 14 |
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 11: Climatic tests - Section 14: Test 11p: Flowing single gas corrosion test |
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DS DS/EN 60512-11- 2 |
Connectors for electronic equipment - Tests and measurements - Part 11-2: Climatic tests - Test 11b: Combined/sequential cold, low air pressure and damp heat |
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DS DS/EN 60512-11- 3 |
Connectors for electronic equipment - Tests and measurements - Part 11-3: Climatic tests - Test 11c: Damp heat, steady state |
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DS DS/EN 60512-11- 4 |
Connectors for electronic equipment - Tests and measurements - Part 11-4: Climatic tests - Test 11d: Rapid change of temperature |
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DS DS/EN 60512-11- 4 |
Connectors for electronic equipment - Tests and measurements - Part 11-14: Climatic tests - Test 11p: Flowing single gas corrosion test |
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DS DS/EN 60512-11- 5 |
Connectors for electronic equipment - Tests and measurements - Part 11-5: Climatic tests - Test 11e: Mould growth |
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DS DS/EN 60512-11- 6 |
Connectors for electronic equipment - Tests and measurements - Part 11-6: Climatic tests - Test 11f: Corrosion, salt mist |
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DS DS/EN 60512-11- 7 |
Connectors for electronic equipment - Tests and measurements - Part 11-7: Climatic tests - Test 11g: Flowing mixed gas corrosion test |
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DS DS/EN 60512-11- 8 |
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 11: Climatic tests - Section 8: Test 11 h: Sand and dust |
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DS DS/EN 60512-11- 9 |
Connectors for electronic equipment - Tests and measurements - Part 11-9: Climatic tests - Test 11i: Dry heat |
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DS DS/EN 60512-1- 2 |
Connectors for electronic equipment - Tests and measurement - Part 1-2: General examination - Test 1b: Examination of dimension and mass |
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DS DS/EN 60512-12- 7 |
Connectors for electronic equipment - Tests and measurements - Part 12-7: Soldering tests - Test 12g: Solderability, wetting balance method |
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DS DS/EN 60512-1- 4/CORR. |
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 1: General - Section 4: Test 1d: Contact protection effectiveness (scoop-proof) |
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DS DS/EN 60512-14- 7 |
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 14: Sealing tests - Section 7: Test 14g: Impacting water |
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DS DS/EN 60512-20- 2 |
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 20-2: Test 20b - Flammability tests - Fireproofness |
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DS DS/EN 60512-2- 1 |
Connectors for electronic equipment - Tests and measurements - Part 2- 1: Electrical continuity and contact resistance tests - Test 2a: Contact resistance - Millivolt level method |
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DS DS/EN 60512-2- 2 |
Connectors for electronic equipment - Tests and measurements - Part 2- 2: Electrical continuity and contact resistance tests - Test 2b: Contact resistance - Specified test current method |
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DS DS/EN 60512-2- 3 |
Connectors for electronic equipment - Tests and measurements - Part 2- 3: Electrical continuity and contact resistance tests - Test 2c: Contact resistance variation |
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DS DS/EN 60512-23- 3 |
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 23-3: Test 23c: Shielding effectiveness of connectors and accessories |
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DS DS/EN 60512-23- 3/CORR.1 |
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 23-3: Test 23c: Shielding effectiveness of connectors and accessories |
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DS DS/EN 60512-23- 4 |
Connectors for electronic equipment - Tests and measurements - Part 23-4: Screening and filtering tests - Test 23d: Transmission line reflections of connectors in the time domain |
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DS DS/EN 60512-2- 5 |
Connectors for electronic equipment - Tests and measurements - Part 2- 5: Electrical continuity and contact resistance tests - Test 2e: Contact disturbance |
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DS DS/EN 60512-25- 1 |
Connectors for electronic equipment - Tests and measurements - Part 25-1: Test 25a - Crosstalk ratio |
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DS DS/EN 60512-25- 2 |
Connectors for electronic equipment - Tests and measurements - Part 25-2: Test 25b: Attenuation (insertion loss) |
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DS DS/EN 60512-25- 3 |
Connectors for electronic equipment - Testing and measurements - Part 25-3: Test 25c - Rise time degradation |
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DS DS/EN 60512-25- 4 |
Connectors for electronic equipment - Testing and measurements - Part 25-4: Test 25d - Propagation delay |
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DS DS/EN 60512-25- 5 |
Connectors for electronic equipment - Tests and measurements - Part 25-5: Test 25e - Return loss |
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DS DS/EN 60512-25- 6 |
Connectors for electronic equipment - Tests and measurements - Part 25-6: Test 25f: Eye pattern and jitter |
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DS DS/EN 60512-2- 6 |
Connectors for electronic equipment - Tests and measurements - Part 2- 6: Electrical continuity and contact resistance tests - Test 2f: Housing (shell) electrical continuity |
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DS DS/EN 60512-3- 1 |
Connectors for electronic equipment - Tests and measurements - Part 3- 1: Insulation tests - Test 3a: Insulation resistance |
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DS DS/EN 60512-4- 1 |
Connectors for electronic equipment - Tests and measurements - Part 4- 1: Voltage stress tests - Test 4a: Voltage proof |
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DS DS/EN 60512-4- 2 |
Connectors for electronic equipment - Tests and measurements - Part 4- 2: Voltage stress tests - Test 4b: Partial discharge |
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DS DS/EN 60512-4- 3 |
Connectors for electronic equipment - Tests and measurements - Part 4- 3: Voltage stress tests - Test 4c: Voltage proof of pre-insulated crimp barrels |
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DS DS/EN 60512-5- 1 |
Connectors for electronic equipment - Tests and measurements - Part 5- 1: Current-carrying capacity tests - Test 5a: Temperature rise |
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DS DS/EN 60512-5- 2 |
Connectors for electronic equipment - Tests and measurements - Part 5- 2: Current-carrying capacity tests - Test 5b: Current-temperature derating |
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DS DS/EN 60512-6- 1 |
Connectors for electronic equipment - Tests and measurements - Part 6- 1: Dynamic stress tests - Test 6a: Acceleration, steady state |
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DS DS/EN 60512-6- 2 |
Connectors for electronic equipment - Tests and measurements - Part 6- 2: Dynamic stress tests - Test 6b: Bump |
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DS DS/EN 60512-6- 3 |
Connectors for electronic equipment - Tests and measurements - Part 6- 3: Dynamic stress tests - Test 6c: Shock |
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DS DS/EN 60512-6- 4 |
Connectors for electronic equipment - Tests and measurements - Part 6- 4: Dynamic stress tests - Test 6d: Vibration (sinusoidal) |
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DS DS/EN 60512-6- 5 |
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 6: Dynamic stress tests - Section 5: Test 6e: Random vibration |
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DS DS/EN 60539- 1 |
Directly heated negative temperature coefficient thermistors - Part 1: Generic specification |
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DS DS/EN 60539- 2 |
Directly heated negative temperature coefficient thermistors - Part 2: Sectional specification - Surface mount negative temperature coefficient thermistors |
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DS DS/EN 60603- 1 |
Connectors for frequencies below 3 MHz for use with printed boards - Part 1: Generic specification - General requirements and guide for the preparation of detail specifications, with assessed quality |
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DS DS/EN 60603- 10 |
Connectors for frequencies below 3 MHz for use with printed boards - Part 10: Two-part connectors for printed boards for basic grid of 2,54 mm (0,1 in), inverted type |
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DS DS/EN 60603- 12 |
Connectors for frequencies below 3 MHz for use with printed boards - Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits |
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DS DS/EN 60603- 13 |
Connectors for frequencies below 3 MHz for use with printed boards - Part 13: Detail specification for two-part connectors of assessed quality, for printed boards for basic grid of 2,54 mm (0,1 in), with free connectors for non-accessible insulation displ |
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DS DS/EN 60603- 14 |
Connectors for frequencies below 3 MHz for use with printed boards - Part 14: Detail specification for circular connectors for low-frequency audio and video applications such as audio, video and audio-visual equipment |
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DS DS/EN 60603- 2 |
Connectors for frequencies below 3 MHz for use with printed boards - Part 2: Detail specification for two-part connectors with assessed quality, for printed boards, for basic grid of 2,54 mm (0.1 in) with common mounting features-Amendment 1: 05/27/2005 |
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DS DS/EN 60603- 3 |
Connectors for frequencies below 3 MHz for use with printed boards - Part 3: Two-part connectors for printed boards having contacts spaced at 2,54 mm (0,1 in) centres and staggered terminations at that same spacing |
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DS DS/EN 60603- 4 |
Connectors for frequencies below 3 MHz for use with printed boards - Part 4: Two-part connectors for printed boards having contacts spaced at 1,91 mm (0,075 in) centres and staggered terminations at that same spacing |
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DS DS/EN 60603- 5 |
Connectors for frequencies below 3 MHz for use with printed boards - Part 5: Edge-socket connectors and two-part connectors for double-sided printed boards with 2,54 mm (0,1 in) spacing |
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DS DS/EN 60603- 6 |
Connectors for frequencies below 3 MHz for use with printed boards - Part 6: Edge-socket connectors and printed-board connectors with 2,54 mm (0,1 in) contact spacing for single or double-sided printed boards of 1,6 mm (0,063 in) nominal thickness |
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DS DS/EN 60603- 7 |
Connectors for frequencies below 3 MHz for use with printed boards - Part 7: Detail specification for connectors, 8-way, including fixed and free connectors with common mating features, with assessed quality |
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DS DS/EN 60603-7- 1 |
Connectors for electronic equipment - Part 7-1: Detail specification for 8- way, shielded free and fixed connectors with common mating features, with assessed quality |
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DS DS/EN 60603-7- 7 |
Connectors for electronic equipment - Part 7-7: Detail specification for 8- way, shielded, free and fixed connectors, for data transmission with frequencies up to 600 MHz (category 7, shielded) |
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DS DS/EN 60603- 8 |
Connectors for frequencies below 3 MHz for use with printed boards - Part 8: Two-part connectors for printed boards, for basic grid of 2,54 mm (0,1 in), with square male contacts of 0,63 mm x 0,63 mm |
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DS DS/EN 60603- 9 |
Connectors for frequencies below 3 MHz for use with printed boards - Part 9: Two-part connectors for printed boards, backpanels and cable connectors, basic grid of 2,54 mm (0,1 in) |
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DS DS/EN 60617- 4 |
Graphical symbols for diagrams - Part 4: Basic passive components |
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DS DS/EN 60617- 5 |
Graphical symbols for diagrams - Part 5: Semiconductors and electron tubes |
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DS DS/EN 60679- 1 |
Quartz crystal controlled oscillators of assessed quality - Part 1: Generic specification |
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DS DS/EN 60679- 1/A1 |
Quartz crystal controlled oscillators of assessed quality - Part 1: Generic specification-(AMENDS DS/EN 60679-1) |
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DS DS/EN 60679- 1/A2 |
Quartz crystal controlled oscillators of assessed quality - Part 1: Generic specification-(AMENDS DS/EN 60679-1) |
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DS DS/EN 60679- 3 |
Quartz crystal controlled oscillators of assessed quality - Part 3: Standard outlines and lead connections |
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DS DS/EN 60679- 4 |
Quartz crystal controlled oscillators of assessed quality - Part 4: Sectional specification - Capability approval |
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DS DS/EN 60679-4- 1 |
Quartz crystal controlled oscillators - A specification in the IEC Quality Assessment System for Electronic Components (IECQ) - Part 4: Sectional specification - Section 1: Blank detail specification |
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DS DS/EN 60679- 5 |
Quartz crystal controlled oscillators of assessed quality - Part 5: Sectional specification - Qualification approval |
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DS DS/EN 60679-5- 1 |
Quartz crystal controlled oscillators of assessed quality - Part 5-1: Blank detail specification - Qualification approval |
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DS DS/EN 60738- 1 |
Thermistors - Directly heated positive step-function temperature coefficient - Part 1: Generic specification |
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DS DS/EN 60738-1- 1 |
Thermistors - Directly heated positive step-function temperature coefficient - Part 1-1: Blank detail specification - Current application - Assessment level EZ |
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DS DS/EN 60738-1- 2 |
Thermistors - Directly heated positive step-function temperature coefficient - Part 1-2: Blank detail specification - Heating element application - Assessment level EZ |
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DS DS/EN 60738-1- 3 |
Thermistors - Directly heated positive step-function temperature coefficient - Part 1-3: Blank detail specification - Inrush current application - Assessment level EZ |
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DS DS/EN 60738-1- 4 |
Thermistors - Directly heated positive step-function temperature coefficient - Part 1-4: Blank detail specification - Sensing application - Assessment level EZ |
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DS DS/EN 60747- 15 |
Discrete semiconductor devices - Part 15: Isolated power semiconductor devices |
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DS DS/EN 60747-16- 1 |
Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers |
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DS DS/EN 60747-16- 10 |
Semiconductor devices - Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits |
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DS DS/EN 60747-16- 3 |
Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters |
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DS DS/EN 60747-16- 4 |
Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches |
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DS DS/EN 60747-5- 1 |
Discrete semiconductor devices and integrated circuits - Part 5-1: Optoelectronic devices - General |
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DS DS/EN 60747-5- 1/A1 |
Discrete semiconductor devices and integrated circuits - Part 5-1: Optoelectronic devices - General-(AMENDS DS/EN 60747-5-1) |
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DS DS/EN 60747-5- 1/A2 |
Discrete semiconductor devices and integrated circuits - Part 5-1: Optoelectronic devices - General-(AMENDS DS/EN 60747-5-1) |
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DS DS/EN 60747-5- 2 |
Discrete semiconductor devices and integrated circuits - Part 5-2: Optoelectronic devices - Essential ratings and characteristics |
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DS DS/EN 60747-5- 2/A1 |
Discrete semiconductor devices and integrated circuits - Part 5-2: Optoelectronic devices - Essential ratings and characteristics-(AMENDS DS/EN 60747-5- 2) |
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DS DS/EN 60747-5- 3 |
Discrete semiconductor devices and integrated circuits - Part 5-3: Optoelectronic devices - Measuring methods |
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DS DS/EN 60747-5- 3/A1 |
Discrete semiconductor devices and integrated circuits - Part 5-3: Optoelectronic devices - Measuring methods-(AMENDS DS/EN 60747-5-3) |
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DS DS/EN 60749 |
Semiconductor devices - Mechanical and climatic test methods |