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DS DS/EN 60749- 1 |
Semiconductor devices - Mechanical and climatic test methods - Part 1: General |
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DS DS/EN 60749- 10 |
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock |
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DS DS/EN 60749- 10/CORR.1 |
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock |
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DS DS/EN 60749- 11 |
Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method |
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DS DS/EN 60749- 11/CORR.1 |
Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method |
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DS DS/EN 60749- 11/CORR.2 |
Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method |
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DS DS/EN 60749- 12 |
Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency |
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DS DS/EN 60749- 12/CORR.1 |
Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency |
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DS DS/EN 60749- 13 |
Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere |
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DS DS/EN 60749- 13/CORR.1 |
Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere |
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DS DS/EN 60749- 14 |
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) |
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DS DS/EN 60749- 15 |
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices |
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DS DS/EN 60749- 16 |
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noice detection (PIND) |
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DS DS/EN 60749- 17 |
Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation |
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DS DS/EN 60749- 18 |
Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose) |
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DS DS/EN 60749- 19 |
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength |
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DS DS/EN 60749- 2 |
Semiconductor Devices - Mechanical and climatic test methods - Part 2: Low air pressure |
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DS DS/EN 60749- 2/CORR.1 |
Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure |
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DS DS/EN 60749- 20 |
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
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DS DS/EN 60749- 21 |
Semiconductor devices Mechanical and climatic test methods Part 21: Solderability |
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DS DS/EN 60749- 22+CORR.1 |
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strenght |
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DS DS/EN 60749- 23 |
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life |
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DS DS/EN 60749- 24 |
Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST |
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DS DS/EN 60749- 25 |
Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling |
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DS DS/EN 60749- 29 |
Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test |
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DS DS/EN 60749- 3 |
Semiconductor devices - Mechanical and climatic test method - Part 3: External visual examination |
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DS DS/EN 60749- 3/CORR.1 |
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination |
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DS DS/EN 60749- 30 |
Semiconductor devices Mechanical and climatic test methods Part 30: Preconditioning of nonhermetic surface mount devices prior to reliability testing |
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DS DS/EN 60749- 31+CORR.1 |
Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced) |
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DS DS/EN 60749- 32+CORR.1 |
Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) |
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DS DS/EN 60749- 33 |
Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave |
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DS DS/EN 60749- 34 |
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling |
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DS DS/EN 60749- 36 |
Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state |
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DS DS/EN 60749- 4 |
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) |
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DS DS/EN 60749- 4/CORR.1 |
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) |
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DS DS/EN 60749- 5 |
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test |
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DS DS/EN 60749- 6 |
Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature |
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DS DS/EN 60749- 6/CORR.1 |
Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature |
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DS DS/EN 60749- 7 |
Semiconductor devices - Mechanical and climatic test method - Part 7: Internal moisture content measurement and the analysis of other residual gases |
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DS DS/EN 60749- 7/CORR.1 |
Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases |
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DS DS/EN 60749- 8+CORR.2 |
Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing |
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DS DS/EN 60749- 9 |
Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking |
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DS DS/EN 60749- 9/CORR.1 |
Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking |
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DS DS/EN 60758 |
Synthetic quartz crystal Specifications and guide to the use |
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DS DS/EN 60825- 1 |
Safety of laser products. Part 1: Equipment classification, requirements and user´s guide |
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DS DS/EN 60825- 1/A1 |
Safety of laser products - Part 1: Equipment classification, requirements and user´s guide-, (AMENDS DS/EN 60825-1) |
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DS DS/EN 60825- 1/A2 |
Safety of laser products - Part 1: Equipment classification, requirements and user´s guide-(AMENDS DS/EN 60825-1) |
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DS DS/EN 60825- 1/A2/CORR. |
Safety of laser products - Part 1: Equipment classification, requirements and user´s guide |
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DS DS/EN 60825- 1/A2/CORR.1 |
Safety of laser products - Part 1: Equipment classification, requirements and user´s guide |
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DS DS/EN 60825- 12 |
Safety of laser products - Part 12: Safety of free space optical communication systems used for transmission of information |
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DS DS/EN 60825- 2 |
Safety of laser products - Part 2: Safety of optical fibre communication systems (OFCS) |
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DS DS/EN 60825- 4 |
Safety of laser products - Part 4: Laser guards |
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DS DS/EN 60825- 4/A1 |
Safety of laser products - Part 4: Laser guards-(AMENDS DS/EN 60825-4) |
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DS DS/EN 60825- 4/A2 |
Safety of laser products - Part 4: Laser guards-(AMENDS DS/EN 60825-4) |
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DS DS/EN 60862- 1 |
Surface acoustic wave (SAW) filters of assessed quality - Part 1: Generic specification |
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DS DS/EN 60862- 2 |
Surface acoustic wave (SAW) filters of assessed quality - Part 2: Guidance on use |
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DS DS/EN 60862- 3 |
Surface acoustic wave (SAW) filters of assessed quality - Part 3: Standard outlines |
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DS DS/EN 60917- 1 |
Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard |
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DS DS/EN 60917- 1/A1 |
Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard-(AMENDS DS/EN 60917- 1) |
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DS DS/EN 60917-2- 1 |
Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Section 1: Detail specification - Dimensions for cabine |
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DS DS/EN 60917-2- 2 |
Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification Interface co-ordination dimensions for the 25 mm equipment practice - Section 2: Detail specification - Dimensions for subracks |
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DS DS/EN 60938- 1 |
Fixed inductors for electromagnetic interference suppression - Part 1: Generic specification |
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DS DS/EN 60938- 2 |
Fixed inductors for electromagnetic interference suppression - Part 2: Sectional specification |
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DS DS/EN 60938-2- 1 |
Fixed inductors for electromagnetic interference suppression - Part 2-1: Blank detail specification - Inductors for which safety tests are required - Assessment level D. |
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DS DS/EN 60938-2- 2 |
Fixed inductors for electromagnetic interference suppression - Part 2-2: Blank detail specification - Inductors for which safety tests are required (only) |
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DS DS/EN 60939- 1 |
Passive filter units for electromagnetic interference suppression Part 1: Generic specification |
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DS DS/EN 60939- 2 |
Passive filter units for electromagnetic interference suppression Part 2: Sectional specification: Passive filter units for which safety tests are appropriate Test methods and general requirements |
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DS DS/EN 61019- 1 |
Surface acoustic wave (SAW) resonators Part 1: Generic specification |
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DS DS/EN 61019- 2 |
Surface acoustic wave (SAW) resonators - Part 2: Guide to the use |
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DS DS/EN 61071- 2 |
Power electronic capacitors - Part 2: Requirements for disconnecting test on fuses, destruction test, self-healing test and endurance test |
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DS DS/EN 61076- 1/A1 |
Connectors with assessed quality, for use in d.c., low frequency analogue and in digital high-speed data applications - Part 1: Generic specification - Capability approval-(AMENDS DS/EN 61076-1) |
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DS DS/EN 61076- 1/A2 |
Connectors with assessed quality, for use in d.c., low frequency analogue and in digital high-speed data applications - Part 1: Generic specification - Capability approval-(AMENDS DS/EN 61076-1) |
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DS DS/EN 61076- 2 |
Connectors for use in d.c. low-frequency analogue and digital high-speed data applications - Part 2: Circular connectors with assessed quality - Sectional specification |
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DS DS/EN 61076-2- 001 |
Connectors for electronic equipment - Part 2-001: Circular connectors - Blank detail specification |
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DS DS/EN 61076-2- 101 |
Connectors for electronic equipment - Part 2-101: Circular connectors - Detail specification for circular connectors M8 with screw- or snap-locking, M12 with screw- locking for low voltage applications |
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DS DS/EN 61076-2- 102 |
Connectors for electronic equipment - Part 2-102: Circular connectors with assessed quality - Detail specification for plugs and jacks for external low voltage power supply |
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DS DS/EN 61076-2- 103 |
Connectors for electronic equipment - Part 2-103: Circular connectors - Detail specification for a range of multipole connectors (type ´XLR´) |
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DS DS/EN 61076- 3 |
Connectors for use in d.c., low-frequency analogue and digital high-speed data applications - Part 3: Rectangular connectors with assessed quality - Sectional specification |
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DS DS/EN 61076-3- 001 |
Connectors for use in d.c., low-frequency analogue and digital high- speed data applications - Part 3-001: Rectangular connectors with assessed quality - Blank detail specification |
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DS DS/EN 61076-3- 100 |
Connectors for use in d.c., low-frequency analogue and digital high speed data applications - Part 3-100: Rectangular connectors with assessed quality - Detail specification for a range of shielded connectors with trapezoidal-shaped shells and non- removab |
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DS DS/EN 61076-3- 101 |
Connectors with assessed quality, for use in d.c. low-frequency analogue and in digital high-speed data applications - Part 3: Rectangular connectors - Section 101: Detail specification for a range of shielded connectors with trapezoidal shaped shells and |
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DS DS/EN 61076-3- 103 |
Connectors for electronic equipment - Part 3-103: Rectangular connectors - Detail specification for single row connectors with non-removable ribbon cable contacts on 1,25 mm pitch used with high speed serial data (HSSDC) |
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DS DS/EN 61076-3- 104 |
Connectors for electronic equipment - Part 3-104: Rectangular connectors - Detail specification for 8-way, shielded free and fixed connectors for data transmissions with frequencies up to 600 MHz minimum |
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DS DS/EN 61076-4- 100 |
Connectors for electronic equipment - Part 4-100: Printed board connectors with assessed quality - Detail specification for two-part connector modules having a grid of 2,5 mm for printed boards and backplanes |
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DS DS/EN 61076-4- 101 |
Connectors for electronic equipment - Part 4-101: Printed board connectors with assessed quality - Detail specification for two-part connector modules, having a basic grid of 2,0 mm for printed boards and backplanes in accordance with IEC 60917 |
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DS DS/EN 61076-4- 101/CORR.1 |
Connectors for electronic equipment - Part 4-101: Printed board connectors with assessed quality - Detail specification for two-part connector modules, having a basic grid of 2,0 mm for printed boards and backplanes in accordance with IEC 60917 |
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DS DS/EN 61076-4- 103 |
Connectors for use in d.c. low-frequency analogue and digital high speed data applications - Part 4-103: Printed board connectors with assessed quality - Detail specification for two-part connectors with shielding and a basic grid of 2,5 mm |
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DS DS/EN 61076-4- 104 |
Connectors for use in d.c., low frequency analogue and digital high speed data applications - Part 4-104: Printed board connectors with assessed quality - Detail specification for two-part modular connectors, basic grid of 2,0 mm, with terminations on mul |
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DS DS/EN 61076-4- 105 |
Connectors with assessed quality, for use in d.c., low-frequency analogue and in digital high-speed data applications - Part 4: Printed board connectors - Section 105: Detail specification for 9 mm circular connector with 3 to 8 contacts for use in a wide |
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DS DS/EN 61076-4- 107 |
Connectors for electronic equipment - Part 4-107: Printed board connectors with assessed quality - Detail specification for shielded two-part connectors having a basic grid of 2,0 mm, fixed part with solder and press-in terminations for printed boards, fr |
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DS DS/EN 61076-4- 108 |
Connectors for electronic equipment - Part 4-108: Printed board connectors with assessed quality - Detail specification for cable-to-board connectors, with a modular pitch of 25 mm and integrated shielding function, applicable for transverse packing densi |
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DS DS/EN 61076-4- 110 |
Connectors for electronic equipment - Part 4-110: Printed board connectors with assessed quality - Detail specification for latched cable connector system having a basic grid of 2,0 mm including full shielding and latching function |
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DS DS/EN 61076-4- 111 |
Connectors for electronic equipment - Part 4-111: Printed board connectors with assessed quality - Detail specification for two-part power connector modules, for printed boards and backplanes having early mating features, and having a basic grid of 2,5 mm |
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DS DS/EN 61076-4- 113 |
Connectors for electronic equipment - Printed board connectors - Part 4-113: Detail specification for two-part connectors having 5 rows with a grid of 2,54 mm for printed boards and backplanes in bus applications |
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DS DS/EN 61076-4- 114 |
Connectors for electronic equipment - Part 4-114: Printed board connectors - Detail specification for two-part connector with integrated shielding function having a grid of 1 mm x 1,5 mm |
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DS DS/EN 61076-4- 115 |
Connectors for electronic equipment - Part 4-115: Printed board connectors - Backplane connector for InfiniBand equipment |
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DS DS/EN 61076- 5 |
Connectors for use in d.c., low-frequency analogue and digital high-speed data applications - Part 5: In-line sockets with assessed quality - Sectional Specification |
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DS DS/EN 61076- 6 |
Connectors for electronic equipment - Part 6: Loose part contacts - Sectional specification |
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DS DS/EN 61076- 7 |
Connectors for use in d.c., low-frequency analogue and digital high speed data applications - Part 7: Cable outlet accessories with assessed quality, including qualification and capability approval - Sectional specification |
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DS DS/EN 61076-7- 001 |
Connectors for electronic equipment - Part 7-001: Cable outlet accessories - Blank detail specification |
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DS DS/EN 61086- 1 |
Coatings for loaded printed wire boards (conformal coatings) - Part 1: Definitions, classification and general requirements |
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DS DS/EN 61086- 2 |
Coatings for loaded printed wire boards (conformal coatings) - Part 2: Methods of test |
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DS DS/EN 61086-3- 1 |
Coatings for loaded printed wire boards (conformal coatings) - Part 3-1: Specifications for individual materials - Coatings for general purpose (Class 1), high reliability (Class 2) and for aerospace (Class 3) |
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DS DS/EN 61182- 7/CORR. |
Printed boards - Electronic data description and transfer - Part 7: Bare board electric test information in digital form |
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DS DS/EN 61188-1- 1 |
Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies |
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DS DS/EN 61188-1- 2 |
Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance |
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DS DS/EN 61188-5- 1 |
Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
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DS DS/EN 61188-5- 2 |
Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
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DS DS/EN 61188-5- 6 |
Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides |
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DS DS/EN 61189- 1/A1 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 1: General test methods and methodology- (AMENDS DS/EN 61189-1) |
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DS DS/EN 61189- 2/A1 |
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures-(AMENDS DS/EN 61189-2+Corr.) |
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DS DS/EN 61189- 3/A1 |
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)-(AMENDS DS/EN 61189-3) |
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DS DS/EN 61190-1- 1 |
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
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DS DS/EN 61190-1- 2 |
Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly |
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DS DS/EN 61190-1- 3 |
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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DS DS/EN 61191- 1 |
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
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DS DS/EN 61191- 2 |
Printed board assemblies - Part 2: Sectional specification - Surface mount soldered assemblies |
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DS DS/EN 61191- 3 |
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
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DS DS/EN 61191- 4 |
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assembly |
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DS DS/EN 61192- 1 |
Workmanship requirements for soldered electronic assemblies - Part 1: General |
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DS DS/EN 61192- 2 |
Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies |
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DS DS/EN 61192- 3 |
Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies |
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DS DS/EN 61192- 4 |
Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies |
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DS DS/EN 61193- 1 |
Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies |
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DS DS/EN 61249-2- 1 |
Materials for printed boards and other interconnecting structures Part 2- 1: Reinforced base materials, clad and unclad Phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad |
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DS DS/EN 61249-2- 10 |
Materials for printed boards and other interconnecting structures - Part 2- 10: Reinforced base materials clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified woven E-glass reinforced laminated sheets of defined flammability (vertica |
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DS DS/EN 61249-2- 11 |
Materials for printed boards and other interconnecting structures - Part 2- 11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical b |
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DS DS/EN 61249-2- 12 |
Materials for printed boards and other interconnection structures - Part 2- 12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non- woven aramid laminate of defined flammability, copper-clad |
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DS DS/EN 61249-2- 13 |
Materials for printed boards and other interconnecting structures - Part 2- 13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper-clad |
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DS DS/EN 61249-2- 18 |
Materials for printed boards and other interconnection structures - Part 2- 18: Reinforced base materials, clad and unclad - Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test), copper-clad |
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DS DS/EN 61249-2- 19 |
Materials for printed boards and other interconnecting structures - Part 2- 19: Reinforced base materials, clad and unclad - Epoxide cross-plied linear fibreglass- reinforced laminated sheets of defined flammabiity (vertical burning test), copper-clad |
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DS DS/EN 61249-2- 2 |
Materials for printed boards and other interconnection structures Part 2- 2: Reinforced base materials, clad and unclad Phenolic cellulose paper reinforced laminate sheets, high electrical grade, copper-clad |
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DS DS/EN 61249-2- 21 |
Materials for printed boards and other interconnecting structures - Part 2- 21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper- clad |
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DS DS/EN 61249-2- 22 |
Materials for printed boards and other interconnection structures Part 2- 22: Reinforced base materials, clad and unclad Modified non-halogenated epoxide woven E- glass laminated sheet of defined flammability (vertical burning test), copper-clad |
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DS DS/EN 61249-2- 23 |
Materials for printed boards and other interconnecting structures Part 2- 23: Reinforced base materials, clad and unclad Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad |
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DS DS/EN 61249-2- 26 |
Materials for printed boards and other interconnecting structures Part 2- 26: Reinforced base materials, clad and unclad Non-halogenated epoxide nonwoven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper- |
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DS DS/EN 61249-2- 4 |
Materials for printed boards and other interconnecting structures - Part 2- 4: Reinforced base materials clad and unclad - Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad |
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DS DS/EN 61249-2- 5 |
Materials for printed boards and other interconnecting structures - Part 2- 5: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper reinforced core/woven E-glass reinforced surfaces laminated sheets of defined flammability (verti |
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DS DS/EN 61249-2- 7 |
Materials for printed boards and interconnection structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad |
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DS DS/EN 61249-2- 8 |
Materials for printed boards and other interconnection structures - Part 2- 8: Reinforced base materials clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper- clad |
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DS DS/EN 61249-2- 9 |
Materials for printed boards and other interconnecting structures - Part 2- 9: Reinforced base materials clad and unclad - Bismaleimide/triazine, modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical bu |
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DS DS/EN 61249-3- 3 |
Materials for printed boards and other interconnecting structures - Part 3- 3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film |
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DS DS/EN 61249-3- 4 |
Materials for printed boards and other interconnecting structures - Part 3- 4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film |
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DS DS/EN 61249-3- 5 |
Materials for printed boards and other interconnecting structures - Part 3- 5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films |
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DS DS/EN 61249-8- 8 |
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings |
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DS DS/EN 61270- 1 |
Capacitors for microwave ovens - Part 1: General |
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DS DS/EN 61337- 1 |
Filters using waveguide type dielectric resonators Part 1: Generic specification |
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DS DS/EN 61337- 2 |
Filters using waveguide type dielectric resonators - Part 2: Guidance for use |
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DS DS/EN 61338- 1 |
Waveguide type dielectric resonators Part 1: Generic specification |
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DS DS/EN 61338-1- 3 |
Waveguide type dielectric resonators - Part 1-3: General information and test conditions - Measurement method of complex relative permittivity for dielectric resonator materials at microwave frequency |
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DS DS/EN 61338- 2 |
Waveguide type dielectric resonators - Part 2: Guidelines for oscillator and filter applications |
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DS DS/EN 61338- 4 |
Waveguide type dielectric resonators Part 4: Sectional specification |
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DS DS/EN 61338-4- 1 |
Waveguide type dielectric resonators Part 4-1: Blank detail specification |
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DS DS/EN 61340-5- 1+CORR. |
Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements |
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DS DS/EN 61340-5- 2+CORR. |
Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide |
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DS DS/EN 61360- 1 |
Standard data element types with associated classification scheme for electric components - Part 1: Definitions - Principles and methods |
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DS DS/EN 61360- 1/A1 |
Standard data element types with associated classification scheme for electric components - Part 1: Definitions - Principles and methods-(AMENDS DS/EN 61360- 1) |
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DS DS/EN 61360- 2 |
Standard data element types with associated classification scheme for electric components - Part 2: EXPRESS dictionary schema |
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DS DS/EN 61360- 2 |
Principles and methods for defining standard data element types with associated classification scheme for electric components - Part 2: EXPRESS Dictionary schema |
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DS DS/EN 61360- 2/A1 |
Standard data element types with associated classification scheme for electric components - Part 2: EXPRESS dictionary schema-(AMENDS DS/EN 61360- 2) |
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DS DS/EN 61360- 4 |
Standard data element types with associated classification scheme for electric components Part 4: IEC reference collection of standard data element types and component classes-Includes CD ROM |
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DS DS/EN 61360- 5 |
Standard data element types with associated classification scheme for electric components Part 5: Extensions to the EXPRESS dictionary schema |
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DS DS/EN 61587- 1 |
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 1: Climatic, mechanical tests and safety aspects for cabinets, racks, subracks and chassis |
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DS DS/EN 61587- 2 |
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 2: Seismic tests for cabinets and racks |
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DS DS/EN 61709 |
Electronic components - Reliability - Reference conditions for failure rates and stress models for conversion |
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DS DS/EN 61747- 1 |
Liquid crystal and solid-state display devices - Part 1: Generic specification |
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DS DS/EN 61747- 1/A1 |
Liquid crystal and solid-state display devices - Part 1: Generic specification-(AMENDS DS/EN 61747-1) |
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DS DS/EN 61747- 2 |
Liquid crystal and solid-state display devices - Part 2: Liquid crystal display modules - Sectional specification |
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DS DS/EN 61747-2- 1 |
Liquid crystal and solid-state display devices - Part 2-1: Passive matrix monochrome LCD modules - Blank detail specification |
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DS DS/EN 61747-2- 2 |
Liquid crystal display devices Part 2-2: Matrix colour LCD modules Blank detail specification |
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DS DS/EN 61747- 3 |
Liquid crystal and solid-state display devices - Part 3: Sectional specification for liquid crystal display (LCD) cells |
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DS DS/EN 61747-3- 1 |
Liquid crystal and solid-state display devices - Part 3-1: Liquid crystal display (LCD) cells - Blank detail specification |
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DS DS/EN 61747- 4 |
Liquid crystal and solid-state display devices - Part 4: Liquid crystal display modules and cells - Essential ratings and characteristics |
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DS DS/EN 61747- 5 |
Liquid crystal and solid-state display devices - Part 5: Environmental, endurance and mechanical test methods |
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DS DS/EN 61747- 6 |
Liquid crystal and solid-state display devices - Part 6: Measuring methods for liquid crystal modules - Transmissive type |
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DS DS/EN 61751 |
Laser modules used for telecommunication - Reliability assessment |
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DS DS/EN 61760- 1 |
Surface mounting technology. Part 1: Standard method for the specification of surface mounting components (SMDs) |
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DS DS/EN 61760- 2 |
Surface mounting technology -- Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide |
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DS DS/EN 61811- 1 |
Electromechanical non-specified time all-or-nothing relays of assessed quality - Part 1: Generic specification |
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DS DS/EN 61811- 10 |
Electromechanical elementary relays of assessed quality - Part 10: Sectional specification - Relays for industrial application |
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DS DS/EN 61811- 11 |
Electromechanical elementary relays of assessed quality - Part 11: Blank detail specification - Relays for industrial application |
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DS DS/EN 61811- 50 |
Electromechanical all-or-nothing relays - Part 50: Sectional specification - Electromechanical all-or-nothing telecom relays of assessed quality |
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DS DS/EN 61811- 51 |
Electromechanical all-or-nothing relays - Part 51: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Non- standardized types and construction |
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DS DS/EN 61811- 52 |
Electromechanical all-or-nothing relays - Part 52: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 20 mm x 10 mm base |
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DS DS/EN 61811- 53 |
Electromechanical all-or-nothing relays - Part 53: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 14 mm x 9 mm base |
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DS DS/EN 61811- 54 |
Electromechanical all-or-nothing relays - Part 54: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 15 x 7,5 mm base |
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DS DS/EN 61811- 55 |
Electromechanical all-or-nothing relays - Part 55: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 11 x 7,5 mm (max.) base |
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DS DS/EN 61837- 1 |
Standard outlines and terminal lead connections of surface mounted devices (SMD) for frequency control and selection - Part 1: Plastic moulded enclosure outlines |
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DS DS/EN 61837- 2 |
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures |
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DS DS/EN 61837- 3 |
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 3: Metal enclosures |
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DS DS/EN 61837- 4 |
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 4: Hybrid enclosure outlines |
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DS DS/EN 61920 |
Infrared free air applications |
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DS DS/EN 61921 |
Power capacitors - Low-voltage power factor correction banks |
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DS DS/EN 61943 |
Integrated circuits - Manufacturing line approval application guideline |
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DS DS/EN 61964 |
Integrated circuits - Memory devices pin configurations |
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DS DS/EN 61965 |
Mechanical safety of cathode ray tubes |
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DS DS/EN 61965 |
Mechanical safety of cathode ray tubes |
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DS DS/EN 61967- 1 |
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 1: General conditions and definitions |
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DS DS/EN 61967- 4 |
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4: Measurement of conducted emissions - 1 ohm/150 ohm direct coupling method |
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DS DS/EN 61967- 5 |
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz - 1 GHz - Part 5: Measurement of conducted emission - Workbench Faraday Cage method |
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DS DS/EN 61967- 6 |
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz - 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method |
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DS DS/EN 61969- 1 |
Mechanical structures for electronic equipment - Outdoor enclosures - Part 1: Design guidelines |
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DS DS/EN 61969- 2 |
Mechanical structures for electronic equipment - Outdoor enclosures - Part 2: Sectional specification - Coordination dimensions for cases and cabinets |
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DS DS/EN 61969-2- 1 |
Mechanical structures for electronic equipment - Outdoor enclosures - Part 2-1: Detail specification - Dimensions for cabinets |
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DS DS/EN 61969-2- 2 |
Mechanical structures for electronic equipment - Outdoor enclosures - Part 2-2: Detail specification - Dimensions for cases |
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DS DS/EN 61969- 3 |
Mekaniske structures for electronic equipment - Outdoor enclosures - Part 3: Sectional specification - Climatic, mechanical tests and safety aspects for cabinets and cases |
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DS DS/EN 61984 |
Connectors - Safety requirements and tests |
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DS DS/EN 61988- 1 |
Plasma display panels - Part 1: Terminology and letter symbols |
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DS DS/EN 61988-2- 1 |
Plasma display panels - Part 2-1: Measuring methods - Optical |
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DS DS/EN 61988-2- 2 |
Plasma Display Panels - Part 2-2: Measuring methods - Optoelectrical |
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DS DS/EN 62007- 1 |
Semiconductor optoelectronic devices for fibre optic system applications - Part 1: Essential ratings and characteristics |
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DS DS/EN 62007- 2 |
Semiconductor optoelectronic devices for fibre optic system applications - Part 2: Measuring methods |
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DS DS/EN 62090 |
Product package labels for electronic components using bar code and two-dimensional symbologies |
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DS DS/EN 62194 |
Method of evaluating the thermal performance of enclosures |
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DS DS/EN 62258- 2 |
Semiconductor die products Part 2: Exchange data formats |
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DS DS/EN 62319- 1 |
Polymeric thermistors Directly heated positive step function temperature coefficient Part 1: Generic specification |
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DS DS/EN 62319-1- 1 |
Polymeric thermistors Directly heated positive step function temperature coefficient Part 1-1: Blank detail specification Current limiting application |
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DS DS/EN 62326- 1 |
Printed boards - Part 1: Generic specification |
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DS DS/EN 62326- 4 |
Printed boards - Part 4: Rigid multilayer boards with interlayer connections - Sectional specification |
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DS DS/EN 62326-4- 1 |
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability Detail Specification - Performance levels A, B and C |
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DS DS/EN ISO 11145 |
Optics and optical instruments - Lasers and laser-related equipment - Vocabulary and symbols |
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DS DS/EN ISO 11146 |
Lasers and laser-related equipment - Test methods for laser beam parameters - Beam widths, divergence angle and beam propagation factor |
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DS DS/EN ISO 11146- 1 |
Lasers and laser-related equipment Test methods for laser beam widths, divergence angles and beam propagation ratios Part 1: Stigmatic and simple astigmatic beams (ISO 11146-1:2005) |
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DS DS/EN ISO 11149 |
Optics and optical instruments - Laser and laser-related equipment - Fibre optic connectors for non-telecommunication laser applications |
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DS DS/EN ISO 11151- 1 |
Lasers and laser-related equipment - Standard optical components - Part 1: Components for the UV, visible and near-infrared spectral ranges |
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DS DS/EN ISO 11151- 2 |
Lasers and laser-related equipment - Standard optical components - Part 2: Components for the infrared spectral range |
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DS DS/EN ISO 11254- 1 |
Laser and laser-related equipment - Determination of laser-induced damage threshold of optical surfaces - Part 1: 1 on 1 test |
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DS DS/EN ISO 11254- 2 |
Lasers and laser-related equipment - Determination of laser-induced damage threshold of optical surfaces - Part 2: S-on-1 test |
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DS DS/EN ISO 11551 |
Optics and optical instruments - Lasers and laser-related equipment - Test method for absorptance of optical laser components |
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DS DS/EN ISO 11553- 1 |
Safety of machinery Laser processing machines Part 1: General safety requirements |
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DS DS/EN ISO 11554 |
Optics and optical instruments - Lasers and laser-related equipment - Test methods for laser beam power, energy and temporal characteristics |
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DS DS/EN ISO 11670 |
Lasers and laser-related equipment - Test methods for laser beam parameters - Beam positional stability |
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DS DS/EN ISO 11807- 1 |
Integrated optics Vocabulary Part 1: Basic terms and symbols |
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DS DS/EN ISO 11807- 2 |
Integrated optics Vocabulary Part 2: Terms used in classification |
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DS DS/EN ISO 12005 |
Lasers and laser-related equipment - Test methods for laser beam parameters - Polarization |
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DS DS/EN ISO 13694 |
Optics and optical instruments - Lasers and laser-related equipment - Test methods for laser beam power (energy) density distribution |
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DS DS/EN ISO 13695 |
Optics and photonics - Lasers and laser-related equipment - Test methods for the spectral characteristics of lasers |
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DS DS/EN ISO 13696 |
Optics and optical instruments - Test methods for radiation scattered by optical components |
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DS DS/EN ISO 14880- 1 |
Microlens array Part 1: Vocabulary |
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DS DS/EN ISO 14881 |
Integrated optics Interfaces Parameters relevant to coupling properties |
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DS DS/EN ISO 15367- 1 |
Lasers and laser-related equipment - Test methods for determination of the shape of a laser beam wavefront - Part 1: Terminology and fundamental aspects |
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DS DS/EN ISO 15367- 2 |
Lasers and laser-related equipment Test methods for determination of the shape of a laser beam wavefront Part 2: Shack-Hartmann sensors |
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DS DS/EN ISO 15902 |
Optics and photonics Diffractive optics Vocabulary |
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DS DS/EN ISO 17526 |
Optics and optical instruments - Lasers and laser-related equipment - Lifetime of lasers |
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DS DS/ENV 50218 |
Description of a parametrized European mini test chip |
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DS DS/ENV 50219 |
Description of the Reliability test structures of the European mini test chip |
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DS DS/ENV 50247- 1 |
Pinnacles Component Information Standard 1.2 - The PCIS tag library |
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DS DS/ENV 50247- 2 |
Pinnacles Component Information Standard 1.2 - The SGML declaration and SGML Document Type Definitions (DTDs) |
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DS DS/ES 59002 |
General requirements for integrated circuits |
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DS DS/ES 59003 |
Product discontinuance of electronic components - Notification by suppliers and distributors |
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DS DS/ES 59006 |
Methods and draft standards for the dynamic characteristization and testing of analog to digital converters (DYNAD) |
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DS DS/ES 59008- 1 |
Data requirements for semiconductor die - Part 1: General requirements |
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DS DS/ES 59008- 2 |
Data requirements for semiconductor die - Part 2: Vocabulary |
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DS DS/ES 59008- 3 |
Data requirements for semiconductor die - Part 3: Mechanical, material and connectivity requirements |
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DS DS/ES 59008-4- 1 |
Data requirements for semiconductor die - Part 4-1: Specific requirements and recommendations - Test and quality |
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DS DS/ES 59008-4- 2 |
Data requirements for semiconductor die - Part 4-2: Specific requirements and recommendations - Handling and storage |
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DS DS/ES 59008-4- 3 |
Data requirements for semiconductor die - Part 4-3: Specific requirements and recommendations - Thermal |
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DS DS/ES 59008-4- 4 |
Data requirements for semiconductor die - Part 4-4: Specific requirements and recommendations - Electrical simulation |
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DS DS/ES 59008-5- 1 |
Data requirements for semiconductor die - Part 5-1: Particular requirements and recommendations for die types - Bare die |
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DS DS/ES 59008-5- 3 |
Data requirements for semiconductor die - Part 5-3: Particular requirements and recommendations for die types - Minimally-packaged die |
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DS DS/ES 59008-6- 1 |
Data requirements for semiconductor die - Part 6-1: Exchange data formats and data dictionary - Data exchange - DDX file format |
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DS DS/ES 59008-6- 2 |
Data requirements for semiconductor die - Part 6-2: Data dictionary |
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DS DS/HD 60027- 2 |
Letter symbols to be used in electrical technology - Part 2: Telecommunications and electronics |
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DS DS/IEC 115-4- 101 |
Fixed power wirewound resistors with solderable axial wire leads - Stability class 5 % - Assessment level E |
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DS DS/IEC 115-4- 102 |
Fixed power wirewound resistors with solderable axial wire leads - Stability class 1 % - Assessment level E |
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DS DS/IEC 115-5- 101 |
Fixed precision wirewound resistors with solderable axial wire leads - Stability class 0.1 % - Assessment level E |
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DS DS/IEC 326- 5 |
Printed boards. Part 5: Specification for single and double sided printed boards with plated-through holes |
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DS DS/IEC 512- 5 |
Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 5: Impact tests (free components), static load tests (fixed components), endurance tests and overload tests |
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DS DS/IEC 60115- 8/A1 |
Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed chip resistors-(AMENDS DS/IEC 115-8) |
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DS DS/IEC 748- 11/A1,2 |
Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits-(AMENDS DS/IEC 748-11) |
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DS DS/IEC/TR 60825- 10 |
Safety of laser products - Part 10: Application guidelines and explanatory notes to IEC 60825-1 |
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DS DS/IEC/TR 60825- 5 |
Safety of lasers products - Part 5: Manufacturerïs checklist for IEC 60825-1 |
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DS DS/IEC/TR 61352 |
Mnemonics and symbols for integrated circuits |
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DS DS/IEC/TS 60825- 7 |
Safety of laser products - Part 7: Safety of products emitting infrared optical radiation, exclusively used for wireless "free air" data transmission and surveillance |
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DS DS/IEC/TS 61587- 3 |
Mechanical structures for electronic equipment - Tests for IEC 60917 and 60297 - Part 3: Electromagnetic shielding performance tests for cabinets, racks and subracks |